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1

Ordered Two-Dimensional Nanowire Array Formation Using Self-Organized Nanoholes of Anodically Oxidized Aluminum

Shingubara, Shoso, Okino, Osamu, Sayama, Yasuyuki, Sakaue, Hiroyuki, Takahagi, Takayuki

Journal:

Japanese Journal of Applied Physics

Year:

1997

File:

PDF, 1.57 MB

1997

2

[IEEE 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) - Wanchai, Hong Kong, China (2010.01.24-2010.01.28)] 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) - Triaxis magnetoresistive (MR) sensor using permalloy plate of distorting magnetic field

Suzuki, M., Fukutani, T., Hirata, T., Aoyagi, S., Shingubara, S., Tajiri, H., Yoshikawa, Y., Nagahata, T.

Year:

2010

Language:

english

File:

PDF, 710 KB

english, 2010

3

AgNO$_{3}$-Dependent Morphological Change of Si Nanostructures Prepared by Single-Step Metal Assisted Etching Method

Shimizu, Tomohiro, Yamaguchi, Takuya, Inoue, Fumihiro, Inada, Mitsuru, Shingubara, Shoso

Journal:

Japanese Journal of Applied Physics

Year:

2012

Language:

english

File:

PDF, 573 KB

english, 2012

4

Gap-filling of Cu Employing Sustained Self-Sputtering with Inductively Coupled Plasma Ionization

T. Ichiki, T. Kikuchi, A. Sano, S. Shingubara, Y. Horiike

Year:

1997

File:

PDF, 1.63 MB

1997

5

Fabricating a Highly Sensitive QCM Sensor Using AAO Nanoholes and Its Application for Biosensing

Asai, Naoto, Shimizu, Tomohiro, Shingubara, Shoso, Ito, Takeshi

Journal:

Proceedings (American Bar Association. Section of International and Comparative Law)

Year:

2017

Language:

english

File:

PDF, 595 KB

english, 2017

6

Digital etching study and fabrication of fine Si lines and dots

Jiro Yamamoto, Takashi Kawasaki, Hiroyuki Sakaue, Shoso Shingubara, Yasuhiro Horiike

Journal:

Thin Solid Films

Year:

1993

Language:

english

File:

PDF, 444 KB

english, 1993

7

Bottom-up copper fill with addition of mercapto alkyl carboxylic acid in electroless plating

Zenglin Wang, Ryo Obata, Hiroyuki Sakaue, Takayuki Takahagi, Shoso Shingubara

Journal:

Electrochimica Acta

Year:

2006

Language:

english

File:

PDF, 216 KB

english, 2006

8

Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology

Fumihiro Inoue, Tomohiro Shimizu, Takumi Yokoyama, Hiroshi Miyake, Kazuo Kondo, Takeyasu Saito, Taro Hayashi, Shukichi Tanaka, Toshifumi Terui, Shoso Shingubara

Journal:

Electrochimica Acta

Year:

2011

Language:

english

File:

PDF, 925 KB

english, 2011

9

Two-dimensional nanowire array formation on Si substrate using self-organized nanoholes of anodically oxidized aluminum

S Shingubara, O Okino, Y Sayama, H Sakaue, T Takahagi

Journal:

Solid-State Electronics

Year:

1999

Language:

english

File:

PDF, 112 KB

english, 1999

10

Bottom-Up Fill of Copper in Deep Submicrometer Holes by Electroless Plating

Shingubara, Shoso, Wang, Zengling, Yaegashi, Osamu, Obata, Ryo, Sakaue, Hiroyuki, Takahagi, Takayuki

Journal:

Electrochemical and Solid-State Letters

Year:

2004

Language:

english

File:

PDF, 267 KB

english, 2004

11

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Inoue, Fumihiro, Philipsen, Harold, Radisic, Aleksandar, Armini, Silvia, Civale, Yann, Leunissen, Peter, Kondo, Muneharu, Webb, Eric, Shingubara, Shoso

Journal:

Electrochimica Acta

Year:

2013

Language:

english

File:

PDF, 3.94 MB

english, 2013

12

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Study of low resistance TSV using electroless plated copper and tungsten-alloy barrier

Inoue, F., Yokoyama, T., Tanaka, S., Yamamoto, K., Koyanagi, M., Fukushima, T., Wang, Z., Shingubara, S.

Year:

2009

Language:

english

File:

PDF, 227 KB

english, 2009

13

[IEEE IEEE International Electron Devices Meeting 2003 - Washington, DC, USA (8-10 Dec. 2003)] IEEE International Electron Devices Meeting 2003 - Bottom-up fill of copper in high aspect ratio via holes by electroless plating

Shingubara, S., Wang, Z., Yaegashi, O., Obata, R., Sakaue, H., Takahagi, T.

Year:

2003

Language:

english

File:

PDF, 237 KB

english, 2003

14

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - Novel seed layer formation using direct electroless copper deposition on ALD-Ru layer for high aspect ratio TSV

Inoue, F., Philipsen, H., Radisic, A., Armini, S., Civale, Y., Leunissen, P., Shingubara, S.

Year:

2012

Language:

english

File:

PDF, 6.11 MB

english, 2012

15

Study of a Dielectric Constant Due to Electronic Polarization Using a Semiempirical Molecular Orbital Method I

Yamada, Kotaro, Saiki, Atsushi, Sakaue, Hiroyuki, Shingubara, Shoso, Takahagi, Takayuki

Journal:

Japanese Journal of Applied Physics

Year:

2001

Language:

english

File:

PDF, 812 KB

english, 2001

16

Fabrication of nanohole array on Si using self-organized porous alumina mask

Shingubara, Shoso, Okino, Osamu, Murakami, Yasuhiko, Sakaue, Hiroyuki, Takahagi, Takayuki

Journal:

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures

Year:

2001

Language:

english

File:

PDF, 682 KB

english, 2001

17

Bottom-Up Fill for Submicrometer Copper Via Holes of ULSIs by Electroless Plating

Wang, Zenglin, Yaegashi, Osamu, Sakaue, Hiroyuki, Takahagi, Takayuki, Shingubara, Shoso

Journal:

Journal of The Electrochemical Society

Year:

2004

Language:

english

File:

PDF, 691 KB

english, 2004

18

Electroplating of ZnO Nanowires Using Nanohole Arrays of Anodized Aluminum Oxide and Effects of Thermal Annealing

Ogata, Ken-Ichi, Shingubara, Shoso, Yorozu, Hiromi, Nakanishi, Tadahiko

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 2.64 MB

english, 2006

19

Electromigration Characteristics of Cu–Al Precipitate in AlCu Interconnection

Shingubara, Shoso, Nishida, Hiroyuki, Sakaue, Hiroyuki, Horiike, Yasuhiro

Journal:

Japanese Journal of Applied Physics

Year:

1994

File:

PDF, 1.30 MB

1994

20

Effect of Additives on Hole Filling Characteristics of Electroless Copper Plating

Wang, Zenglin, Yaegashi, Osamu, Sakaue, Hiroyuki, Takahagi, Takayuki, Shingubara, Shoso

Journal:

Japanese Journal of Applied Physics

Year:

2004

Language:

english

File:

PDF, 91 KB

english, 2004

21

Effect of PEG molecular weight on bottom-up filling of copper electrodeposition for PCB interconnects

Yin, L., Liu, Z. H., Yang, Z. P., Wang, Z. L., Shingubara, S.

Journal:

Transactions of the Institute of Metal Finishing

Year:

2010

Language:

english

File:

PDF, 436 KB

english, 2010

22

Development of Glyoxylic Acid Based Electroless Copper Deposition on Ruthenium

Inoue, F., Philipsen, H., van der Veen, M., Van Huylenbroeck, S., Armini, S., Struyf, H., Shingubara, S., Tanaka, T.

Journal:

ECS Transactions

Year:

2015

Language:

english

File:

PDF, 5.62 MB

english, 2015

23

Formation of Vortices around a Sinkhole

Shingubara, Shosou, Kawakubo, Tatsuyuki

Journal:

Journal of the Physical Society of Japan

Year:

1984

File:

PDF, 580 KB

1984

24

Highly sensitive quartz crystal microbalance based biosensor using Au dendrite structure

Asai, Naoto, Terasawa, Hideaki, Shimizu, Tomohiro, Shingubara, Shoso, Ito, Takeshi

Journal:

Japanese Journal of Applied Physics

Year:

2018

Language:

english

File:

PDF, 837 KB

english, 2018

25

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Effect of W addition for Cu diffusion barrier property of electroless CoB films formed on SiO2

Iseri, T., Shindo, S., Shimizu, T., Ito, T., Matsumoto, M., Shingubara, S.

Year:

2018

Language:

english

File:

PDF, 733 KB

english, 2018

26

Synthesis of Vertical High-Density Epitaxial Si(100) Nanowire Arrays on a Si(100) Substrate Using an Anodic Aluminum Oxide Template

T. Shimizu, T. Xie, J. Nishikawa, S. Shingubara, S. Senz, U. Gösele

Journal:

Advanced Materials

Year:

2007

Language:

english

File:

PDF, 255 KB

english, 2007

27

Low energy silicon etching technologies

Y. Horiike, T. Hashimoto, K. Asami, J. Yamamoto, Y. Todokoro, H. Sakaue, S. Shingubara, H. Shindo

Journal:

Microelectronic Engineering

Year:

1991

Language:

english

File:

PDF, 593 KB

english, 1991

28

Interaction of a void and a grain boundary under a high electric current stress employing three-dimensional molecular dynamics simulation

Shoso Shingubara, Isao Utsunomiya, Takayuki Takahagi

Journal:

Applied Surface Science

Year:

1995

Language:

english

File:

PDF, 789 KB

english, 1995

29

Transition process from one celled vortex to two celled vortex

S. Shingubara, K. Hagiwara, R. Fukushima, T. Kawakubo

Journal:

Fluid Dynamics Research

Year:

1988

Language:

english

File:

PDF, 444 KB

english, 1988

30

Characterization of sputtered tungsten nitride film and its application to Cu electroless plating

Zenglin Wang, Zonghuai Liu, Zupei Yang, Shoso Shingubara

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 1.21 MB

english, 2008

31

Wet treatment for preparing atomically smooth Si(1 0 0) wafer surface

Hiroyuki Sakaue, Yutaka Taniguchi, Yosuke Okamura, Shoso Shingubara, Takayuki Takahagi

Journal:

Applied Surface Science

Year:

2004

Language:

english

File:

PDF, 365 KB

english, 2004

32

Aspect ratio dependence of hysteresis property of high density Co wire array buried in porous alumina template

S Shingubara, K Morimoto, M Nagayanagi, T Shimizu, O Yaegashi, G.R Wu, H Sakaue, T Takahagi, K Takase

Journal:

Journal of Magnetism and Magnetic Materials

Year:

2004

Language:

english

File:

PDF, 208 KB

english, 2004

33

Strain imaging of a perpendicular recording head in a Hard Disk Drive

K. Takata, N. Kurata, S. Tamura, S. Shingubara, S. Nakahara, N. Tagawa, Y. Arai

Journal:

Journal of Magnetism and Magnetic Materials

Year:

2010

Language:

english

File:

PDF, 455 KB

english, 2010

34

Reduction of pitch of nanohole array by self-organizing anodic oxidation after nanoimprinting

S. Shingubara, S. Maruo, T. Yamashita, M. Nakao, T. Shimizu

Journal:

Microelectronic Engineering

Year:

2010

Language:

english

File:

PDF, 1.39 MB

english, 2010

35

Measurement of electromigration-induced stress in aluminum alloy interconnection

Kazuya Kusaka, Takao Hanabusa, Shoso Shingubara, Tatsuya Matsue, Osami Sakata

Journal:

Year:

2008

Language:

english

File:

PDF, 383 KB

english, 2008

36

Formation of aluminum nanodot array by combination of nanoindentation and anodic oxidation of aluminum

Shoso Shingubara, Yusuhiko Murakami, Kazunori Morimoto, Takayuki Takahagi

Journal:

Surface Science

Year:

2003

Language:

english

File:

PDF, 380 KB

english, 2003

37

Growth of gallium phosphide layers by chemical beam epitaxy on oxide patterned (001)silicon substrates

V Narayanan, N Sukidi, Chimin Hu, N Dietz, K.J Bachmann, S Mahajan, S Shingubara

Journal:

Materials Science and Engineering: B

Year:

1998

Language:

english

File:

PDF, 350 KB

english, 1998

38

Depth profile analysis of polyimide film treated by potassium hydroxide

H. Okumura, T. Takahagi, N. Nagai, S. Shingubara

Journal:

Journal of Polymer Science Part B: Polymer Physics

Year:

2003

Language:

english

File:

PDF, 172 KB

english, 2003

39

Synthesis of epitaxial Si(100) nanowires on Si(100) substrate using vapor–liquid–solid growth in anodic aluminum oxide nanopore arrays

T. Shimizu, S. Senz, S. Shingubara, U. Gösele

Journal:

Applied Physics A: Materials Science & Processing

Year:

2007

Language:

english

File:

PDF, 337 KB

english, 2007

40

Electromigration Reliability Study of a GMR Spin Valve Device

Takeda, Y., Sakue, H., Takahagi, T., Verbruggen, A. H., Shingubara, S.

Journal:

MRS Proceedings

Year:

1999

Language:

english

File:

PDF, 1.30 MB

english, 1999

41

Molecular dynamics simulation of void electromigration under a high-density electric current stress in an aluminum interconnection

Shoso Shingubara, Isao Utsunomiya, Taizo Fujii

Journal:

Electronics and Communications in Japan (Part II: Electronics))

Year:

1995

Language:

english

File:

PDF, 913 KB

english, 1995

42

Formation of 1D and 2D Gold Nanoparticle Arrays by Divalent DNA–Gold Nanoparticle Conjugates

Yuichi Ohya, Nozomi Miyoshi, Mirai Hashizume, Takuya Tamaki, Takeaki Uehara, Shoso Shingubara, Akinori Kuzuya

Journal:

Year:

2012

Language:

english

File:

PDF, 967 KB

english, 2012

43

Cu2ZnSnS4 thin films and nanowires prepared by different single-step electrodeposition method in quaternary electrolyte

Minsung Jeon, Tomohiro Shimizu, Shoso Shingubara

Journal:

Materials Letters

Year:

2011

Language:

english

File:

PDF, 758 KB

english, 2011

44

Surface morphologies of sputter-deposited aluminum films studied using a high-resolution phase-measuring laser interferometric microscope

Furukawa, Masakazu, Yamamoto, Yoshito, Ikakura, Hiroshi, Tanaka, Nobuo, Hashimoto, Masayuki, Sano, Atsushi, Shingubara, Shoso

Journal:

Year:

1996

Language:

english

File:

PDF, 496 KB

english, 1996

45

Formation and characterization of single-step electrodeposited Cu2ZnSnS4 thin films: Effect of complexing agent volume

M. Jeon, Y. Tanaka, T. Shimizu, S. Shingubara

Journal:

Energy Procedia

Year:

2011

Language:

english

File:

PDF, 4.24 MB

english, 2011

46

Self-Organization of a Porous Alumina Nanohole Array Using a Sulfuric/Oxalic Acid Mixture as Electrolyte

Shingubara, S., Morimoto, K., Sakaue, H., Takahagi, T.

Journal:

Electrochemical and Solid-State Letters

Year:

2004

Language:

english

File:

PDF, 388 KB

english, 2004

47

DNA–Gold Conjugates: Formation of 1D and 2D Gold Nanoparticle Arrays by Divalent DNA–Gold Nanoparticle Conjugates (Small 15/2012)

Yuichi Ohya, Nozomi Miyoshi, Mirai Hashizume, Takuya Tamaki, Takeaki Uehara, Shoso Shingubara, Akinori Kuzuya

Journal:

Year:

2012

File:

PDF, 2.61 MB

2012

48

Adsorption of Pd nanoparticles catalyst in high aspect ratio through-Si vias for electroless deposition

Fumihiro Inoue, Tomohiro Shimizu, Hiroshi Miyake, Ryohei Arima, Toshihiko Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara

Journal:

Electrochimica Acta

Year:

2012

Language:

english

File:

PDF, 1.22 MB

english, 2012

49

Improved control of silicon nanowire growth by the vapor–liquid–solid method using a diffusion barrier layer between catalyst and substrate

Koto, Makoto, Shimizu, Tomohiro, Shingubara, Shoso

Journal:

Journal of Crystal Growth

Year:

2013

Language:

english

File:

PDF, 1.62 MB

english, 2013

50

[IEEE 2011 International Meeting for Future of Electron Devices, Kansai (IMFEDK) - Suita, Osaka, Japan (2011.05.19-2011.05.20)] 2011 International Meeting for Future of Electron Devices - Control of crystalline orientation and diameter of Si nanowires based on VLS method and electrodeposition of catalyst using AAO template

Wang, Q., Shimizu, T., Shingubara, S.

Year:

2011

Language:

english

File:

PDF, 529 KB

english, 2011

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